4TH International Congress on Technology - Engineering & SCIENCE - Kuala Lumpur - Malaysia (2017-08-05)
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Effect Of Radius Variation At The Hinge Plane For Thermal Stress Of Vehicle Tire Mold
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In this study, in order to analyze the thermal stress of mold, the thinnest part of vehicle tire mold was chosen as the numerical object. And we analyzed the thermal stress of mold according to the the radiu variation at the hinge plane. The minimum size of the mesh was 0.1㎜, and the grid number was about more than 830 thousand. Also the temperature values of 6 points according to the vertical downward direction of the thinnest part were analyzed with the time change. The numerical condition was that heat flux was 321,200 W/m2, 440,000 W/m2 and 880,000 W/m2, and measuring time was 0.1 second, 0.2 seconds, 0.5 seconds and 1.0 seconds, respectively. The temperature gradient and amount of heat transfer at the Z=6㎜ were extremely large when the radius value of the hinge plane was the 2.0㎜. As a result, the highest value of thermal stress was 0.0036 kg/mm2, and took place in the radius value of 2.0㎜.
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Keywords: Computational Fluid Dynamics, Heat Flux, Hinge plnae, Radius Variation, Thermal Stress.
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Dong Guk Ko, Seong Hyeon Baek, Jun Cong Ge, Nag Jung Choi, Min Soo Kim,
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