International Congress on Engineering, Sciences and Innovative Technologies (ICESIT 2020) - Kuala Lumpur - Malaysia (2020-02-13)

Thermal conductivity and mechanical properties of polycarbonate nanocomposite containing copper-exfoliated graphite nanoplatelet hybrid powder
In this work, polycarbonate/copper-exfoliated graphite nanoplatelet (PC/Cu-xGnP) composites were prepared using twin-screw extruder. Before compounding, two types of Cu-xGnP hybrid powder were prepared, one is fully embedded xGnP and the other is partially embedded xGnP in copper. TEM images of hybrid powder showed the partially and fully embedded xGnP in copper. The thermal conductivity of PC nanocomposite increased with the increasing Cu, xGnP and Cu-xGnP content. Especially, partially embedded PC/Cu-xGnP nanocomposite showed the highest values of thermal conductivity at the same filler concentration. The tensile strength of PC/Cu and PC/xGnP nanocomposites did not change significantly with the filler content, but that of PC/Cu-xGnP nanocomposite showed the highest value at 10% and gradually decreased in the subsequent content. The tensile modulus of PC nanocomposites increased with the filler content. In the mechanical properties, fully embedded PC/Cu-xGnP showed better results than partially embedded PC/Cu-xGnP.
Professor Kwan Han Yoon, Professor Jae Cheol Park, Professor Young Sil Lee