4TH International Congress on Technology - Engineering & SCIENCE - Kuala Lumpur - Malaysia (2017-08-05)
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Correlation Between Cavity Fraction Of Cu2+ Ionic Imprinting And Concentration Of H+ Ion On Amino-silica Hybrid To Cu2+ Ion Adsorption
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Abstract: It has been studied the correlation between cavity fraction of Cu2+ ionic imprinting and concentration of H+ ion in solution media upon adsorbent ability of amino-silica hybrid of Cu2+ ionic imprinting (Cu(II)-IIP) in adsorbing Cu2+ ions in solution. In order to identify the active sites playing a role upon Cu2+ ion adsorption, identification of functional groups, surface morphology, element compositions, surface area, volume, and porous diameter of adsorbent were investigated in this experiment. The interaction between Cu(II)-IIP and Cu(II) ion was evaluated with a kinetic model and an adsorption isotherm to determine the adsorption rate, adsorption isotherm model, and adsorption capacity value. Adsorption process was performed using batch method with interacting Cu(II)-IIP adsorbent with each cavity fraction of ionic imprinting of Cu(II)-IIP-1; Cu(II)-IIP-2; Cu(II)-IIP-3; and Cu(II)-IIP-4 of 97.69; 98.75; 97.87; 96.89 % in solution media with each concentration of H+ ion of 0.5; 1.0; 1.5; 2.5; 5.0 mmol L-1, respectively. The adsorption data obtained showed that Cu(II)-IIP with different ionic imprinting fractions gave relatively similar adsorption models, the higher the concentration of H+ ion in solution media, the lower the concentration of Cu2+ ion adsorbed on the Cu(II)-IIP adsorbent. From the evaluation results of the adsorption kinetic and adsorption isotherm parameters show that the values of the adsorption rate and capacity of ionic imprinted materials on Cu(II)-IIP-1; Cu(II)-IIP-2; Cu(II)-IIP-3; and Cu(II)-IIP-4 are bigger than non-imprinted polymer (NIP). The Cd2+ ionic imprinting cavity fraction played a role as active sites prepared from different concentrations of Cu2+ ion produces different adsorption rate and capacity upon ion target (Cu2+ ion). Adsorption competition of Cu2+ and H+ ion toward active sites is influential to number of Cu2+ ion adsorbed on NIP and Cu(II)ï€IIP. The higher the concentration of H+ ion, the lower the number of Cu2+ ion adsorbed. The Cu2+ ionic imprinted material from amino-silica hybrid can be used as effective material to bind Cu2+ ion in solution. Keywords: adsorption active site, aminoï€silica hybrid, imprinted ionic.
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Buhani Buhani, Suharso Suharso, Aspita Laila, Sumadi Sumadi
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